| Electronic Components Datasheet Search |
|
PSD4235G2 Datasheet(PDF) 21 Page - STMicroelectronics |
|
|
|||||||||||||||||||||||||||||
PSD4235G2 Datasheet(HTML) 21 Page - STMicroelectronics |
|
21 / 89 page ![]() 21/89 PSD4235G2 Primary Flash Memory and Secondary Flash memory Description. The primary Flash memo- ry is divided evenly into 8 sectors. The secondary Flash memory is divided evenly into 4 sectors. Each sector of either memory block can be sepa- rately protected from Program and Erase cycles. Flash memory may be erased on a sector-by-sec- tor basis, and programmed word-by-word. Flash sector erasure may be suspended while data is read from other sectors of the block and then re- sumed after reading. During a Program or Erase cycle in Flash memory, the status can be output on the Ready/Busy pin (PE4). This pin is set up using PSDsoft Express. Memory Block Select Signals. The DPLD gen- erates the Select signals for all the internal memo- ry blocks (see the section entitled “PLDs”, on page 31). Each of the sectors of the primary Flash mem- ory has a Select signal (FS0-FS7) which can con- tain up to three product terms. Each of the sectors of the secondary Flash memory has a Select sig- nal (CSBOOT0-CSBOOT3) which can contain up to three product terms. Having three product terms for each Select signal allows a given sector to be mapped in different areas of system memory. When using a MCU with separate Program and Data space (80C51XA), these flexible Select sig- nals allow dynamic re-mapping of sectors from one memory space to the other before and after IAP. The SRAM block has a single Select signal (RS0). Ready/Busy (PE4). This signal can be used to output the Ready/Busy status of the PSD. The out- put is a 0 (Busy) when a Flash memory block is be- ing written to, or when a Flash memory block is being erased. The output is a 1 (Ready) when no Write or Erase cycle is in progress. Memory Operation. The primary Flash memory and secondary Flash memory are addressed through the MCU Bus Interface. The MCU can ac- cess these memories in one of two ways: s The MCU can execute a typical bus Write or Read operation just as it would if accessing a RAM or ROM device using standard bus cycles. s The MCU can execute a specific instruction that consists of several Write and Read operations. This involves writing specific data patterns to special addresses within the Flash memory to invoke an embedded algorithm. These instructions are summarized in Table 29. Typically, the MCU can read Flash memory using Read operations, just as it would read a ROM de- vice. However, Flash memory can only be erased and programmed using specific instructions. For example, the MCU cannot write a single byte di- rectly to Flash memory as one would write a byte to RAM. To program a word into Flash memory, the MCU must execute a Program instruction, then test the status of the Programming event. This sta- tus test is achieved by a Read operation or polling Ready/Busy (PE4). Flash memory can also be read by using special instructions to retrieve particular Flash device in- formation (sector protect status and ID). |
|
Link URL |
| Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link to Datasheet | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |