ADSP-BF504 datasheet(52/80 Pages) AD

52 / 80 page

Rev. PrC

Page 52 of 80

January 2010

ADSP-BF504/F,ADSP-BF506F

Preliminary Technical Data

PROCESSOR — ENVIRONMENTAL CONDITIONS

To determine the junction temperature on the application

printed circuit board use:

where:

TJ = Junction temperature (°C).

TCASE = Case temperature (°C) measured by customer at top

center of package.

JT = From Table 41 and Table 42.

PD = Power dissipation (see Total Power Dissipation on Page 29

for the method to calculate PD).

Values of

θJA are provided for package comparison and printed

circuit board design considerations.

θJA can be used for a first

order approximation of TJ by the equation:

where:

TA = Ambient temperature (°C)

Values of

θJC are provided for package comparison and printed

circuit board design considerations when an external heat sink

is required.

Values of

θJB are provided for package comparison and printed

circuit board design considerations.

In Table 41 and Table 42, airflow measurements comply with

JEDEC standards JESD51-2 and JESD51-6, and the junction-to-

board measurement complies with JESD51-8. The junction-to-

case measurement complies with MIL-STD-883 (Method

1012.1). All measurements use a 2S2P JEDEC test board.

Figure 49. Typical Rise and Fall Times (10%–90%) versus Load Capacitance

for Driver A at VDDEXT = Max

Figure 50. Typical Rise and Fall Times (10%–90%) versus Load Capacitance

for Driver B at VDDEXT = Min

Figure 51. Typical Rise and Fall Times (10%–90%) versus Load Capacitance

for Driver B at VDDEXT = Max

Figure 52. Typical Rise and Fall Times (10%–90%) versus Load Capacitance

for Driver C at VDDEXT = Min

Figure 53. Typical Rise and Fall Times (10%–90%) versus Load Capacitance

for Driver C at VDDEXT = Max

Figure 54. Typical Rise and Fall Times (10%–90%) versus Load Capacitance

for Driver D at VDDEXT = Min

Figure 55. Typical Rise and Fall Times (10%–90%) versus Load Capacitance

for Driver D at VDDEXT = Max

TCASE

()

Table 41. Thermal Characteristics (88-Lead LFCSP)

Parameter

Condition

Typical

Unit

θJA

0 linear m/s air flow

26.2

°C/W

θJMA

1 linear m/s air flow

23.7

°C/W

θJMA

2 linear m/s air flow

22.9

°C/W

θJB

16.0

°C/W

θJC

9.8

°C/W

ΨJT

0 linear m/s air flow

0.21

°C/W

ΨJT

1 linear m/s air flow

0.36

°C/W

ΨJT

2 linear m/s air flow

0.43

°C/W

Table 42. Thermal Characteristics (120-Lead LQFP)

Parameter

Condition

Typical

Unit

θJA

0 linear m/s air flow

26.9

°C/W

θJMA

1 linear m/s air flow

24.2

°C/W

θJMA

2 linear m/s air flow

23.3

°C/W

θJB

16.4

°C/W

θJC

12.7

°C/W

ΨJT

0 linear m/s air flow

0.50

°C/W

ΨJT

1 linear m/s air flow

0.77

°C/W

ΨJT

2 linear m/s air flow

1.02

°C/W

()

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