MB9BF412R datasheet(53/121 Pages) SPANSION

53 / 121 page

D a t a S h e e t

MB9B410R-DS706-00026-3v0-E, March 11, 2015

CONFIDENTIAL

 Handling Precations

Any semiconductor devices have inherently a certain rate of failure. The possibility of failure is greatly

affected by the conditions in which they are used (circuit conditions, environmental conditions, etc.). This

page describes precautions that must be observed to minimize the chance of failure and to obtain higher

reliability from your Spansion semiconductor devices.

1. Precautions for Product Design

This section describes precautions when designing electronic equipment using semiconductor devices.

・Absolute Maximum Ratings

Semiconductor devices can be permanently damaged by application of stress (voltage, current, temperature,

etc.) in excess of certain established limits, called absolute maximum ratings. Do not exceed these ratings.

・Recommended Operating Conditions

Recommended operating conditions are normal operating ranges for the semiconductor device. All the

device's electrical characteristics are warranted when operated within these ranges.

Always use semiconductor devices within the recommended operating conditions. Operation outside these

ranges may adversely affect reliability and could result in device failure.

No warranty is made with respect to uses, operating conditions, or combinations not represented on the data

sheet. Users considering application outside the listed conditions are advised to contact their sales

representative beforehand.

・Processing and Protection of Pins

These precautions must be followed when handling the pins which connect semiconductor devices to power

supply and input/output functions.

(1) Preventing Over-Voltage and Over-Current Conditions

Exposure to voltage or current levels in excess of maximum ratings at any pin is likely to cause

deterioration within the device, and in extreme cases leads to permanent damage of the device. Try to

prevent such overvoltage or over-current conditions at the design stage.

(2) Protection of Output Pins

Shorting of output pins to supply pins or other output pins, or connection to large capacitance can

cause large current flows. Such conditions if present for extended periods of time can damage the

device.

Therefore, avoid this type of connection.

(3) Handling of Unused Input Pins

Unconnected input pins with very high impedance levels can adversely affect stability of operation.

Such pins should be connected through an appropriate resistance to a power supply pin or ground pin.

・Latch-up

Semiconductor devices are constructed by the formation of P-type and N-type areas on a substrate. When

subjected to abnormally high voltages, internal parasitic PNPN junctions (called thyristor structures) may

be formed, causing large current levels in excess of several hundred mA to flow continuously at the power

supply pin. This condition is called latch-up.

CAUTION: The occurrence of latch-up not only causes loss of reliability in the semiconductor device, but

can cause injury or damage from high heat, smoke or flame. To prevent this from happening, do the

following:

(1) Be sure that voltages applied to pins do not exceed the absolute maximum ratings. This should

include attention to abnormal noise, surge levels, etc.

(2) Be sure that abnormal current flows do not occur during the power-on sequence.

Code: DS00-00004-3E

MB9BF412R Datasheet(PDF) 53 Page - SPANSION

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