MB9BF412R datasheet(56/121 Pages) SPANSION

56 / 121 page

D a t a S h e e t

March 11, 2015, MB9B410R-DS706-00026-3v0-E

CONFIDENTIAL

3. Precautions for Use Environment

Reliability of semiconductor devices depends on ambient temperature and other conditions as described

above.

For reliable performance, do the following:

(1) Humidity

Prolonged use in high humidity can lead to leakage in devices as well as printed circuit boards. If high

humidity levels are anticipated, consider anti-humidity processing.

(2) Discharge of Static Electricity

When high-voltage charges exist close to semiconductor devices, discharges can cause abnormal

operation. In such cases, use anti-static measures or processing to prevent discharges.

(3) Corrosive Gases, Dust, or Oil

Exposure to corrosive gases or contact with dust or oil may lead to chemical reactions that will

adversely affect the device. If you use devices in such conditions, consider ways to prevent such

exposure or to protect the devices.

(4) Radiation, Including Cosmic Radiation

Most devices are not designed for environments involving exposure to radiation or cosmic radiation.

Users should provide shielding as appropriate.

(5) Smoke, Flame

CAUTION: Plastic molded devices are flammable, and therefore should not be used near combustible

substances. If devices begin to smoke or burn, there is danger of the release of toxic gases.

Customers considering the use of Spansion products in other special environmental conditions should

consult with sales representatives.

Please check the latest handling precautions at the following URL.

http://www.spansion.com/fjdocuments/fj/datasheet/e-ds/DS00-00004.pdf

MB9BF412R Datasheet(PDF) 56 Page - SPANSION