MB9BF412R datasheet(54/121 Pages) SPANSION

54 / 121 page

D a t a S h e e t

March 11, 2015, MB9B410R-DS706-00026-3v0-E

CONFIDENTIAL

・Observance of Safety Regulations and Standards

Most countries in the world have established standards and regulations regarding safety, protection from

electromagnetic interference, etc. Customers are requested to observe applicable regulations and standards

in the design of products.

・Fail-Safe Design

Any semiconductor devices have inherently a certain rate of failure. You must protect against injury,

damage or loss from such failures by incorporating safety design measures into your facility and equipment

such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating

conditions.

・Precautions Related to Usage of Devices

Spansion semiconductor devices are intended for use in standard applications (computers, office automation

and other office equipment, industrial, communications, and measurement equipment, personal or

household devices, etc.).

CAUTION: Customers considering the use of our products in special applications where failure or

abnormal operation may directly affect human lives or cause physical injury or property damage, or where

extremely high levels of reliability are demanded (such as aerospace systems, atomic energy controls, sea

floor repeaters, vehicle operating controls, medical devices for life support, etc.) are requested to consult

with sales representatives before such use. The company will not be responsible for damages arising from

such use without prior approval.

2. Precautions for Package Mounting

Package mounting may be either lead insertion type or surface mount type. In either case, for heat resistance

during soldering, you should only mount under Spansion's recommended conditions. For detailed

information about mount conditions, contact your sales representative.

・Lead Insertion Type

Mounting of lead insertion type packages onto printed circuit boards may be done by two methods: direct

soldering on the board, or mounting by using a socket.

Direct mounting onto boards normally involves processes for inserting leads into through-holes on the

board and using the flow soldering (wave soldering) method of applying liquid solder. In this case, the

soldering process usually causes leads to be subjected to thermal stress in excess of the absolute ratings for

storage temperature. Mounting processes should conform to Spansion recommended mounting conditions.

If socket mounting is used, differences in surface treatment of the socket contacts and IC lead surfaces can

lead to contact deterioration after long periods. For this reason it is recommended that the surface treatment

of socket contacts and IC leads be verified before mounting.

・Surface Mount Type

Surface mount packaging has longer and thinner leads than lead-insertion packaging, and therefore leads are

more easily deformed or bent. The use of packages with higher pin counts and narrower pin pitch results in

increased susceptibility to open connections caused by deformed pins, or shorting due to solder bridges.

You must use appropriate mounting techniques. Spansion recommends the solder reflow method, and has

established a ranking of mounting conditions for each product. Users are advised to mount packages in

accordance with Spansion ranking of recommended conditions.

MB9BF412R Datasheet(PDF) 54 Page - SPANSION

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