PPC440GX-3RF800C datasheet(59/93 Pages) AMCC

59 / 93 page

440GX – Power PC 440GX Embedded Processor

AMCC

Revision 1.15 – August 30, 2007

Data Sheet

Package Thermal Specifications

Thermal resistance values for the CBGA and PBGA packages in a convection environment are as follows:

Parameter

Symbol

Package

Airflow

ft/min (m/sec)

Unit

Notes

0 (0)

100 (0.51)

200 (1.02)

Junction-to-case thermal resistance

Ceramic

<0.1

°C/W

Plastic

1.2

°C/W

1, 3

Case-to-ambient thermal resistance (w/o heat

sink)

Ceramic

18.9

17.7

16.3

°C/W

Plastic

20.8

°C/W

2, 3

Range

Min

Nom

Max

Junction-to-ball (typical)

Ceramic

1.5

2.2

°C/W

Plastic

8.2

°C/W

Notes:

1. Case temperature, TC, is measured at top center of case surface with device soldered to circuit board.

2. The case-to-ambient thermal resistance is measured in a JEDEC JESD51-6 standard environment; and may not accurately predict

thermal performance in production equipment environments. The operational case temperature must be maintained.

3. Modeled on standard JEDEC 2S2P card, 50x50mm

4. 1.5 °C/W is the theoretical

JB using an infinite heat sink. The larger number applies to the module mounted on a 1.8 mm thick, 2P card

using 1oz. copper power planes, with an effective heat transfer area of 75mm2.

PPC440GX-3RF800C Datasheet(PDF) 59 Page - Applied Micro Circuits Corporation

PPC440GX-3RF800C Datasheet(HTML) 59 Page - Applied Micro Circuits Corporation

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