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PPC440GX-3RF800C Datasheet(PDF) 90 Page - Applied Micro Circuits Corporation |
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PPC440GX-3RF800C Datasheet(HTML) 90 Page - Applied Micro Circuits Corporation |
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90 / 93 page ![]() 440GX – Power PC 440GX Embedded Processor 90 AMCC Revision 1.15 – August 30, 2007 Data Sheet Revision Log Date Contents of Modification 08/07/2002 Add revision log. 08/30/2002 Change EMC0:1TxD0:1 and EMC0:1TxEn TOV from 15 to 11 ns. 09/25/2002 Update for L2 cache 10/22/2002 Add heat sink mounting information . 11/20/2002 Update I/O timing data. 01/07/2003 Update PCI-X I/O voltage specification. Correct package drawing 01/22/2003 Correct description of SysReset signal. Update for 533MHz parts and add power supply current values. 03/25/2003 Update DDR SDRAM timing. Change RTBIxTX and RX control signals to data signals. 06/16/2003 Add 667MHz part numbers, update I/O specifications, and fill in missing data points. 07/15/2003 Update information concerning higher speed parts, bus clock ratios, the duplicate trace signals, and initialization strapping pins. Update Ethernet signals with new and moved signals. 07/17/2003 Remove IBM Confidential. 12/02/2003 Revise DDR SDRAM I/O section. 01/13/2004 Correct TrcTS6 signal data (pin assignment and multiplexing). 02/12/2004 Restore VDD/OVDD voltage sequence restriction. 02/25/2004 Add three Revision C part numbers. 03/04/2004 Update part number list. Update dimensions on package drawing. 03/25/2004 Correct GMCTxClk signal description from input-only to I/O. 05/12/2004 Add plastic package data, new power data, and update part number list. 05/20/2004 Upgrade 533MHz ceramic part to 105 °C rating. 06/15/2004 Correct dimensions on ceramic package drawing. 06/30/2004 Replace misssing 533MHz C temperature range part. 11/01/2004 Add information on minimum SysClk and TRST duration during power-on reset. Remove power sequence restrictions note from Absolute Maximum Rating table. Restate power sequencing restrictions in Recommended DC Operating Conditions table. Convert to AMCC format. 12/09/2004 Restore “Preliminary” to document classification. 06/16/2005 Add S (no L2 cache support) temperature range part numbers. 07/01/2005 Add reduced-lead ceramic and lead-free plastic part numbers. 10/17/2005 Clarify DDR SDRAM interface diagram. 11/07/2005 Remove metal-layer specification from technology description. Add logo and number nomenclature to package drawing. 12/22/2005 Update I/O timing specs for EMC0:3TxD, GMC0RxD0:3, GMC1RxD0:3, GMCRxDV, GMC1RxCtl, GMCRxD0:7, GMCRxEr, GMCCrS, GMCTxD0:7. |
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