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KM416RD8AS-RBM80 Datasheet(PDF) 33 Page - Samsung semiconductor

Part # KM416RD8AS-RBM80
Description  128Mbit RDRAM 256K x 16 bit x 2*16 Dependent Banks Direct RDRAMTM for Consumer Package
PDF  64 Pages
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Manufacturer  SAMSUNG [Samsung semiconductor]
Direct Link  http://www.samsung.com/Products/Semiconductor
Logo SAMSUNG - Samsung semiconductor

KM416RD8AS-RBM80 Datasheet(HTML) 33 Page - Samsung semiconductor

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Page 30
KM416RD8AS
Direct RDRAM
Rev. 0.9 July 1999
Target
Control Register Summary
Table 16 summarizes the RDRAM control registers. Detail
is provided for each control register in Figure 27 through
Figure 43. Read-only bits which are shaded gray are unused
and return zero. Read-write bits which are shaded gray are
reserved and should always be written with zero. The RIMM
SPD Application Note describes additional read-only
configuration registers which are present on Direct RIMMs.
The state of the register fields are potentially affected by the
IO Reset operation or the SETR/CLRR operation. This is
indicated in the text accompanying each register diagram.
Table 16: Control Register Summary
SA11..SA0
Register
Field
read-write/ read-only
Description
02116
INIT
SDEVID
read-write, 6 bits
Serial device ID. Device address for control register read/write.
PSX
read-write, 1 bit
Power select exit. PDN/NAP exit with device addr on DQA5..0.
SRP
read-write, 1 bit
SIO repeater. Used to initialize RDRAM.
NSR
read-write, 1 bit
NAP self-refresh. Enables self-refresh in NAP mode.
PSR
read-write, 1 bit
PDN self-refresh. Enables self-refresh in PDN mode.
LSR
read-write, 1 bit
Low power self-refresh. Enables low power self-refresh.
TEN
read-write, 1 bit
Temperature sensing enable.
TSQ
read-write, 1 bit
Temperature sensing output.
DIS
read-write, 1 bit
RDRAM disable.
02216
TEST34
TEST34
read-write, 16 bits
Test register. Do not read or write after SIO reset.
02316
CNFGA
REFBIT
read-only, 3 bit
Refresh bank bits. Used for multi-bank refresh.
DBL
read-only, 1 bit
Double. Specifies doubled-bank architecture
MVER
read-only, 6 bit
Manufacturer version. Manufacturer identification number.
PVER
read-only, 6 bit
Protocol version. Specifies version of Direct protocol supported.
02416
CNFGB
BYT
read-only, 1 bit
Byte. Specifies an 8-bit or 9-bit byte size.
DEVTYP
read-only, 3 bit
Device type. Device can be RDRAM or some other device category.
SPT
read-only, 1 bit
Split-core. Each core half is an individual dependent core.
CORG
read-only, 6 bit
Core organization. Bank, row, column address field sizes.
SVER
read-only, 6 bit
Stepping version. Mask version number.
04016
DEVID
DEVID
read-write, 5 bits
Device ID. Device address for memory read/write.
04116
REFB
REFB
read-write, 4 bits
Refresh bank. Next bank to be refreshed by self-refresh.
04216
REFR
REFR
read-write, 9 bits
Refresh row. Next row to be refreshed by REFA, self-refresh.
04316
CCA
CCA
read-write, 7 bits
Current control A. Controls IOL output current for DQA.
ASYMA
read-write, 2 bits
Asymmetry control. Controls asymmetry of VOL/VOH swing for DQA.
04416
CCB
CCB
read-write, 7 bits
Current control B. Controls IOL output current for DQB.
ASYMB
read-write, 2 bits
Asymmetry control. Controls asymmetry of VOL/VOH swing for DQB.
04516
NAPX
NAPXA
read-write, 5 bits
NAP exit. Specifies length of NAP exit phase A.
NAPX
read-write, 5 bits
NAP exit. Specifies length of NAP exit phase A + phase B.
DQS
read-write, 1 bits
DQ select. Selects CMD framing for NAP/PDN exit.
04616
PDNXA
PDNXA
read-write, 13 bits
PDN exit. Specifies length of PDN exit phase A.
04716
PDNX
PDNX
read-write, 13 bits
PDN exit. Specifies length of PDN exit phase A + phase B.
04816
TPARM
TCAS
read-write, 2 bits
tCAS-C core parameter. Determines tOFFP datasheet parameter.
TCLS
read-write, 2 bits
tCLS-C core parameter. Determines tCAC and tOFFP parameters.
TCDLY0
read-write, 3 bits
tCDLY0-C core parameter. Programmable delay for read data.



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