SPSB0813 datasheet(10/135 Pages) STMICROELECTRONICS

10 / 135 page

Table 4. Transient immunity ratings according to ISO 7637-2

PARAMETER

VALUE

UNIT

ISO 7637-2 and IEC 62215-3 transients

immunity according to

“OEM_HW_Requirements_For_CAN_LIN_

FR-Interfaces_V1.3_2012” and IBEE EMC

test specifications (1) (LIN and CAN)

Pulse1

-100

Pulse2a

+75

Pulse3a

-150

Pulse3b

+100

1. ISO 7637 is a system level transient test. Different system level configurations may lead to different results.

2.3

Temperature ranges and thermal data

Table 5. Temperature ranges and thermal data

Symbol

Parameter

Condition

Min

Typ

Max

Unit

Item

Tamb

Operating temperature

(ECU environment)

-40

125

°C

F.019

Operating junction

temperature

-40

175

°C

F.020

Tstg

Storage temperature

-55

150

°C

F.021

TW ON

Thermal over

temperature warning

threshold

140

160

°C

F.022

TSD1 OFF (1)

Thermal shut-down

junction temperature 1

165

185

°C

F.023

TSD2 OFF (1)

Thermal shut-down

temperature

175

195

°C

F.024

TSD12hys (1)

Thermal shut-down

temperature hysteresis

°C

F.025

tfTjTW

Thermal warning / shut

down filter time

Tested by scan

µs

F.026

RTh jamb (2)

Thermal resistance

junction-to-ambient

°C/W

F.027

1. Non-overlapping

2. The values quoted are for PCB 129 mm x 60 mm x 1.6 mm, FR4, four layers; Cu thickness 0.070 mm (outer layers). Cu

thickness 0.035 mm (inner layers), thermal vias separation 1.2 mm, thermal via diameter 0.3 mm +/- 0.08 mm, Cu thickness

on vias 0.025 mm, footprint dimension 3.5 mm x 3.5 mm

All parameters are guaranteed in the temperature range from -40 to 50°C (unless otherwise specified); the device

is still operative and functional at higher temperatures (up to 175°C).

Parameters limits at higher temperatures than 150°C may change with respect to what is specified as per the

standard temperature range.

Device functionality at high temperature is guaranteed by characterization.

SPSB081 embeds a multitude of junctions housed in a relatively small piece of silicon. The devices contain,

among all the described features, four high-sides, two voltage regulators (one of which can work as voltage

tracker). For this reason, using the thermal impedance of a single junction (that is, voltage regulator or major

power dissipation contributor) does not allow to predict thermal behavior of the whole device and therefore it is

not possible to assess if a device is thermally suitable for a given activation profile and loads characteristics.

Some representative and realistic worst-case thermal profiles are described in the below paragraph. The following

measurement methods can be easily implemented, by final user, for a specific activation profile.

Activation profile battery voltage: 16 V, ambient temperature starts at 85°C.

DC activation:

•

V1 (3.3V) charged with 70 mA; Rdson = 470 Ω (DC activation)

•

V2 (3.3V) charged with 50 mA; Rdson = 680 Ω (DC activation)

SPSB081

Temperature ranges and thermal data

DS14048 - Rev 1

page 10/135

SPSB0813 Datasheet(PDF) 10 Page - STMicroelectronics

SPSB0813 Datasheet(HTML) 10 Page - STMicroelectronics

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 ...More

Datasheet Download

Link URL