Electronic Components Datasheet Search
  British  ▼
ALLDATASHEET.CO.UK

X  

TJA1080ATS/2/T Datasheet(PDF) 42 Page - NXP Semiconductors

Part # TJA1080ATS/2/T
Description  FlexRay transceiver Support of 60 ns minimum bit time
PDF  49 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors

TJA1080ATS/2/T Datasheet(HTML) 42 Page - NXP Semiconductors

Back Button TJA1080ATS/2/T Datasheet HTML 38Page - NXP Semiconductors TJA1080ATS/2/T Datasheet HTML 39Page - NXP Semiconductors TJA1080ATS/2/T Datasheet HTML 40Page - NXP Semiconductors TJA1080ATS/2/T Datasheet HTML 41Page - NXP Semiconductors TJA1080ATS/2/T Datasheet HTML 42Page - NXP Semiconductors TJA1080ATS/2/T Datasheet HTML 43Page - NXP Semiconductors TJA1080ATS/2/T Datasheet HTML 44Page - NXP Semiconductors TJA1080ATS/2/T Datasheet HTML 45Page - NXP Semiconductors TJA1080ATS/2/T Datasheet HTML 46Page - NXP Semiconductors Next Button
Zoom Inzoom in Zoom Outzoom out
 42 / 49 page
background image
TJA1080A
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 5 — 24 February 2011
42 of 49
NXP Semiconductors
TJA1080A
FlexRay transceiver
13.4 Reflow soldering
Key characteristics in reflow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 17) than a SnPb process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 15 and 16
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 17.
Table 15.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (
°C)
Volume (mm3)
< 350
≥ 350
< 2.5
235
220
≥ 2.5
220
220
Table 16.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (
°C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
260
260
1.6 to 2.5
260
250
245
> 2.5
250
245
245



Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49


Datasheet Download

Go To PDF Page


Link URL



Does ALLDATASHEET help your business so far?  [ DONATE ] 

About Alldatasheet   |   Advertisement   |   Contact us   |   Privacy Policy   |   Link to Datasheet    |   Link Exchange   |   Manufacturer List
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com