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V62/13624-01XE-R Datasheet(PDF) 30 Page - Texas Instruments |
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V62/13624-01XE-R Datasheet(HTML) 30 Page - Texas Instruments |
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30 / 77 page ![]() 30 MSP430F2132-EP SLAS913A – JULY 2013 – REVISED AUGUST 2013 www.ti.com Product Folder Links: MSP430F2132-EP Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated (1) To improve EMI on the XT1 oscillator, the following guidelines should be observed. (a) Keep the trace between the device and the crystal as short as possible. (b) Design a good ground plane around the oscillator pins. (c) Prevent crosstalk from other clock or data lines into oscillator pins XIN and XOUT. (d) Avoid running PCB traces underneath or adjacent to the XIN and XOUT pins. (e) Use assembly materials and praxis to avoid any parasitic load on the oscillator XIN and XOUT pins. (f) If conformal coating is used, ensure that it does not induce capacitive/resistive leakage between the oscillator pins. (g) Do not route the XOUT line to the JTAG header to support the serial programming adapter as shown in other documentation. This signal is no longer required for the serial programming adapter. (2) Use of the LFXT1 Crystal Oscillator at TA > 105°C is not ensured. It is recommended that an external digital clock source or the internal DCO is used to provide clocking. (3) Includes parasitic bond and package capacitance (approximately 2 pF per pin). Because the PCB adds additional capacitance, it is recommended to verify the correct load by measuring the ACLK frequency. For a correct setup, the effective load capacitance should always match the specification of the crystal that is used. (4) Frequencies below the MIN specification set the fault flag. Frequencies above the MAX specification do not set the fault flag. Frequencies in between might set the flag. (5) Measured with logic-level input frequency but also applies to operation with crystals. 5.20 Crystal Oscillator LFXT1, Low-Frequency Mode (1) (2) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted). See Typical Characteristics - LFXT1 Oscillator in HF Mode (XTS = 1) for related characterization graphs. PARAMETER TEST CONDITIONS VCC MIN TYP MAX UNIT fLFXT1,LF LFXT1 oscillator crystal frequency, LF mode 0, 1 XTS = 0, LFXT1Sx = 0 or 1 1.8 V to 3.6 V 32768 Hz fLFXT1,LF,logic LFXT1 oscillator logic level square wave input frequency, LF mode XTS = 0, XCAPx = 0, LFXT1Sx = 3 1.8 V to 3.6 V 10000 32768 50000 Hz OALF Oscillation allowance for LF crystals XTS = 0, LFXT1Sx = 0, fLFXT1,LF = 32768 Hz, CL,eff = 6 pF 500 kΩ XTS = 0, LFXT1Sx = 0, fLFXT1,LF = 32768 Hz, CL,eff = 12 pF 200 CL,eff Integrated effective load capacitance, LF mode(3) XTS = 0, XCAPx = 0 1 pF XTS = 0, XCAPx = 1 5.5 XTS = 0, XCAPx = 2 8.5 XTS = 0, XCAPx = 3 11 Duty cycle, LF mode XTS = 0, Measured at ACLK, fLFXT1,LF = 32768 Hz 2.2 V, 3 V 30 50 70 % fFault,LF Oscillator fault frequency, LF mode(4) XTS = 0, XCAPx = 0, LFXT1Sx = 3(5) 2.2 V, 3 V 10 10000 Hz (1) Calculated using the box method: [MAX(-40...125°C) - MIN(-40...125°C)]/MIN(-40...125°C)/[125°C - (-40°C)] (2) Calculated using the box method: [MAX(1.8...3.6 V) - MIN(1.8...3.6 V)]/MIN(1.8...3.6 V)/(3.6 V - 1.8 V) 5.21 Internal Very-Low-Power Low-Frequency Oscillator (VLO) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER TA VCC MIN TYP MAX UNIT fVLO VLO frequency -40°C to 85°C 2.2 V, 3 V 4 12 20 kHz 125°C 23 dfVLO/dT VLO frequency temperature drift(1) 2.2 V, 3 V 0.5 %/°C dfVLO/dVCC VLO frequency supply voltage drift(2) 1.8 V to 3.6 V 4 %/V |
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