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V62/13624-01XE-R Datasheet(PDF) 31 Page - Texas Instruments |
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V62/13624-01XE-R Datasheet(HTML) 31 Page - Texas Instruments |
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31 / 77 page ![]() 31 MSP430F2132-EP www.ti.com SLAS913A – JULY 2013 – REVISED AUGUST 2013 Product Folder Links: MSP430F2132-EP Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated (1) To improve EMI on the XT2 oscillator the following guidelines should be observed: (a) Keep the trace between the device and the crystal as short as possible. (b) Design a good ground plane around the oscillator pins. (c) Prevent crosstalk from other clock or data lines into oscillator pins XIN and XOUT. (d) Avoid running PCB traces underneath or adjacent to the XIN and XOUT pins. (e) Use assembly materials and praxis to avoid any parasitic load on the oscillator XIN and XOUT pins. (f) If conformal coating is used, ensure that it does not induce capacitive or resistive leakage between the oscillator pins. (g) Do not route the XOUT line to the JTAG header to support the serial programming adapter as shown in other documentation. This signal is no longer required for the serial programming adapter. (2) Use of the LFXT1 Crystal Oscillator at TA > 105°C is not ensured. It is recommended that an external digital clock source or the internal DCO is used to provide clocking. (3) Includes parasitic bond and package capacitance (approximately 2 pF per pin). Because the PCB adds additional capacitance, it is recommended to verify the correct load by measuring the ACLK frequency. For a correct setup, the effective load capacitance should always match the specification of the used crystal. (4) Requires external capacitors at both terminals. Values are specified by crystal manufacturers. (5) Frequencies below the MIN specification set the fault flag, frequencies above the MAX specification do not set the fault flag, and frequencies in between might set the flag. (6) Measured with logic-level input frequency, but also applies to operation with crystals. 5.22 Crystal Oscillator LFXT1, High-Frequency Mode (1) (2) PARAMETER TEST CONDITIONS VCC MIN TYP MAX UNIT fLFXT1,HF0 LFXT1 oscillator crystal frequency, HF mode 0 XTS = 1, XCAPx = 0, LFXT1Sx = 0 1.8 V to 3.6 V 0.4 1 MHz fLFXT1,HF1 LFXT1 oscillator crystal frequency, HF mode 1 XTS = 1, XCAPx = 0, LFXT1Sx = 1 1.8 V to 3.6 V 1 4 MHz fLFXT1,HF2 LFXT1 oscillator crystal frequency, HF mode 2 XTS = 1, XCAPx = 0, LFXT1Sx = 2 1.8 V to 3.6 V 2 10 MHz 2.2 V to 3.6 V 2 12 3 V to 3.6 V 2 16 fLFXT1,HF,logic LFXT1 oscillator logic-level square-wave input frequency, HF mode XTS = 1, XCAPx = 0, LFXT1Sx = 3 1.8 V to 3.6 V 0.4 10 MHz 2.2 V to 3.6 V 0.4 12 3 V to 3.6 V 0.4 16 OAHF Oscillation allowance for HF crystals (see Figure 27 and Figure 28) XTS = 1, XCAPx = 0, LFXT1Sx = 0, fLFXT1,HF = 1 MHz, CL,eff = 15 pF 2700 Ω XTS = 1, XCAPx = 0, LFXT1Sx = 1, fLFXT1,HF = 4 MHz, CL,eff = 15 pF 800 XTS = 1, XCAPx = 0, LFXT1Sx = 2, fLFXT1,HF = 16 MHz, CL,eff = 15 pF 300 CL,eff Integrated effective load capacitance, HF mode(3) XTS = 1, XCAPx = 0(4) 1 pF Duty cycle, HF mode XTS = 1, XCAPx = 0, Measured at P2.0/ACLK, fLFXT1,HF = 10 MHz 2.2 V, 3 V 40 50 60 % XTS = 1, XCAPx = 0, Measured at P2.0/ACLK, fLFXT1,HF = 16 MHz 40 50 60 fFault,HF Oscillator fault frequency (5) XTS = 1, XCAPx = 0, LFXT1Sx = 3(6) 2.2 V, 3 V 30 300 kHz 5.23 Timer0_A3 over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER TEST CONDITIONS VCC MIN TYP MAX UNIT fTA Timer0_A3 clock frequency Internal: SMCLK, ACLK External: TACLK, INCLK Duty cycle = 50% ± 10% 2.2 V 10 MHz 3 V 16 tTA,cap Timer0_A3 capture timing TA0.0, TA0.1, TA0.2 2.2 V, 3 V 20 ns |
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