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V62/13624-01XE-R Datasheet(PDF) 31 Page - Texas Instruments

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Part # V62/13624-01XE-R
Description  Mixed Signal Microcontroller
PDF  77 Pages
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

V62/13624-01XE-R Datasheet(HTML) 31 Page - Texas Instruments

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31
MSP430F2132-EP
www.ti.com
SLAS913A – JULY 2013 – REVISED AUGUST 2013
Product Folder Links: MSP430F2132-EP
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
(1)
To improve EMI on the XT2 oscillator the following guidelines should be observed:
(a) Keep the trace between the device and the crystal as short as possible.
(b) Design a good ground plane around the oscillator pins.
(c) Prevent crosstalk from other clock or data lines into oscillator pins XIN and XOUT.
(d) Avoid running PCB traces underneath or adjacent to the XIN and XOUT pins.
(e) Use assembly materials and praxis to avoid any parasitic load on the oscillator XIN and XOUT pins.
(f) If conformal coating is used, ensure that it does not induce capacitive or resistive leakage between the oscillator pins.
(g) Do not route the XOUT line to the JTAG header to support the serial programming adapter as shown in other documentation. This
signal is no longer required for the serial programming adapter.
(2)
Use of the LFXT1 Crystal Oscillator at TA > 105°C is not ensured. It is recommended that an external digital clock source or the internal
DCO is used to provide clocking.
(3)
Includes parasitic bond and package capacitance (approximately 2 pF per pin). Because the PCB adds additional capacitance, it is
recommended to verify the correct load by measuring the ACLK frequency. For a correct setup, the effective load capacitance should
always match the specification of the used crystal.
(4)
Requires external capacitors at both terminals. Values are specified by crystal manufacturers.
(5)
Frequencies below the MIN specification set the fault flag, frequencies above the MAX specification do not set the fault flag, and
frequencies in between might set the flag.
(6)
Measured with logic-level input frequency, but also applies to operation with crystals.
5.22 Crystal Oscillator LFXT1, High-Frequency Mode
(1) (2)
PARAMETER
TEST CONDITIONS
VCC
MIN
TYP
MAX
UNIT
fLFXT1,HF0
LFXT1 oscillator crystal
frequency, HF mode 0
XTS = 1, XCAPx = 0, LFXT1Sx = 0
1.8 V to 3.6 V
0.4
1
MHz
fLFXT1,HF1
LFXT1 oscillator crystal
frequency, HF mode 1
XTS = 1, XCAPx = 0, LFXT1Sx = 1
1.8 V to 3.6 V
1
4
MHz
fLFXT1,HF2
LFXT1 oscillator crystal
frequency, HF mode 2
XTS = 1, XCAPx = 0, LFXT1Sx = 2
1.8 V to 3.6 V
2
10
MHz
2.2 V to 3.6 V
2
12
3 V to 3.6 V
2
16
fLFXT1,HF,logic
LFXT1 oscillator logic-level
square-wave input
frequency, HF mode
XTS = 1, XCAPx = 0, LFXT1Sx = 3
1.8 V to 3.6 V
0.4
10
MHz
2.2 V to 3.6 V
0.4
12
3 V to 3.6 V
0.4
16
OAHF
Oscillation allowance for HF
crystals (see Figure 27 and
Figure 28)
XTS = 1, XCAPx = 0, LFXT1Sx = 0,
fLFXT1,HF = 1 MHz, CL,eff = 15 pF
2700
Ω
XTS = 1, XCAPx = 0, LFXT1Sx = 1,
fLFXT1,HF = 4 MHz, CL,eff = 15 pF
800
XTS = 1, XCAPx = 0, LFXT1Sx = 2,
fLFXT1,HF = 16 MHz, CL,eff = 15 pF
300
CL,eff
Integrated effective load
capacitance, HF mode(3)
XTS = 1, XCAPx = 0(4)
1
pF
Duty cycle, HF mode
XTS = 1, XCAPx = 0,
Measured at P2.0/ACLK,
fLFXT1,HF = 10 MHz
2.2 V, 3 V
40
50
60
%
XTS = 1, XCAPx = 0,
Measured at P2.0/ACLK,
fLFXT1,HF = 16 MHz
40
50
60
fFault,HF
Oscillator fault frequency (5)
XTS = 1, XCAPx = 0, LFXT1Sx = 3(6)
2.2 V, 3 V
30
300
kHz
5.23 Timer0_A3
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
MIN
TYP
MAX
UNIT
fTA
Timer0_A3 clock frequency
Internal: SMCLK, ACLK
External: TACLK, INCLK
Duty cycle = 50% ± 10%
2.2 V
10
MHz
3 V
16
tTA,cap
Timer0_A3 capture timing
TA0.0, TA0.1, TA0.2
2.2 V, 3 V
20
ns



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