| Electronic Components Datasheet Search |
|
ADSP-SC596 Datasheet(PDF) 21 Page - Analog Devices |
|
|
|||||||||||||||||||||||||||||
ADSP-SC596 Datasheet(HTML) 21 Page - Analog Devices |
|
21 / 134 page ![]() ADSP-SC595/SC596/SC598 Preliminary Technical Data Rev. PrD | Page 21 of 134 | May 2022 actively load data from serial memories. In external host boot modes, the processors receive data over a serial interface from an external host device. The boot modes are shown in Table 7. These modes are imple- mented by the SYS_BMODE[n] bits of the reset configuration register and are sampled during power-on resets and software initiated resets. In the ADSP-SC595/SC596/SC598 processors, the Arm Cortex- A55 (Core 0) controls the boot process, including loading all internal and external memory. The option for secure boot is available on all models. Thermal Monitoring Unit (TMU) The thermal monitoring unit (TMU) provides on-chip tem- perature measurement for applications that require substantial power consumption. The TMU is integrated into the processor die and digital infrastructure using an MMR-based system access to measure the die temperature variations in real-time. TMU features include the following: • On-chip temperature sensing • Programmable over temperature and under temperature limits • Programmable conversion rate • Averaging feature available Power Supplies The processors have separate power supply connections for • Internal (VDD_INT) • External (VDD_EXT) • External (VDD_REF) • HADC/TMU (VDD_ANA) • DMC (VDD_DMC) • PLL (VDD_PLL) All power supplies must meet the specifications provided in the Preliminary Operating Conditions section. All external supply pins must be connected to the same power supply. Power Management As shown in Table 8, the processors support six different power domains, which maximizes flexibility while maintaining com- pliance with industry standards and conventions. The power dissipated by a processor is largely a function of the clock frequency and the square of the operating voltage. For example, reducing the clock frequency by 25% results in a 25% reduction in dynamic power dissipation. Power-Up and Power-Down Sequencing At all times (including during power-up/power-down sequenc- ing), the VDD_REF, VDD_ANA, and VDD_EXT supplies must stay within the VDELTA_EXT_REF specification listed in the Pre- liminary Operating Conditions table. Processor pins in the VDD_EXT domain might have an unknown state during power-up/power-down. External components sharing these pins on the board must determine if there are any issues that need addressing based on this behavior. See the ADSP- SC595/SC596/SC598 Designer Quick Reference for pins in the VDD_EXT domain. SYS_XTAL0 and SYS_XTAL1 oscillations (SYS_CLKIN0 and SYS_CLKIN1) start when power is applied to the VDD_REF pins. The rising edge of SYS_HWRST initiates the PLL locking sequence. The rising edge of SYS_HWRST must occur after all voltage supplies and SYS_CLKIN0 and SYS_CLKIN1 oscillations are valid. For further details and information, see the Power-Up Reset Timing section. Target Board JTAG Emulator Connector The Analog Devices DSP tools product line of JTAG emulators uses the IEEE 1149.1 JTAG test access port of the processors to monitor and control the target board processor during emula- tion. The Analog Devices DSP tools product line of JTAG emulators provides emulation at full processor speed, allowing inspection and modification of memory, registers, and proces- sor stacks. The processor JTAG interface ensures the emulator does not affect target system loading or timing. For information on JTAG emulator operation, see the appropri- ate emulator hardware user’s guide at SHARC Processors Software and Tools. SYSTEM DEBUG The processors include various features that allow easy system debug. These are described in the following sections. Table 7. Boot Modes SYS_BMODE[n] Setting Boot Mode 000 No boot 001 SPI2 flash 010 External SPI2 host 011 External UART0 host 100 External LP0 host 101 Octal SPI flash 110 eMSI boot (eMMC) Table 8. Power Domains Power Domain VDD Range All Internal Logic VDD_INT DDR3/DDR3L VDD_DMC HADC/TMU VDD_ANA SYS_CLKIN0/1 VDD_REF 1 1 VDD_REF requires a minimum of 10 nF and 100 nF decoupling capacitance to meet source/sink requirements. PLL0/1 VDD_PLL 2 2 Connect VDD_PLL to VDD_INT. See ADSP-SC595/SC596/SC598 Designer Quick Reference for additional details. All Other I/O (Includes SYS, JTAG, and Ports Pins) VDD_EXT |
|
Link URL |
| Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link to Datasheet | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |