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ADSP-SC596 Datasheet(PDF) 21 Page - Analog Devices

Part # ADSP-SC596
Description  SHARC Dual-Core DSP with Arm Cortex-A55
PDF  134 Pages
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Manufacturer  AD [Analog Devices]
Direct Link  http://www.analog.com
Logo AD - Analog Devices

ADSP-SC596 Datasheet(HTML) 21 Page - Analog Devices

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ADSP-SC595/SC596/SC598
Preliminary Technical Data
Rev. PrD
|
Page 21 of 134
|
May 2022
actively load data from serial memories. In external host boot
modes, the processors receive data over a serial interface from
an external host device.
The boot modes are shown in Table 7. These modes are imple-
mented by the SYS_BMODE[n] bits of the reset configuration
register and are sampled during power-on resets and software
initiated resets.
In the ADSP-SC595/SC596/SC598 processors, the Arm Cortex-
A55 (Core 0) controls the boot process, including loading all
internal and external memory. The option for secure boot is
available on all models.
Thermal Monitoring Unit (TMU)
The thermal monitoring unit (TMU) provides on-chip tem-
perature measurement for applications that require substantial
power consumption. The TMU is integrated into the processor
die and digital infrastructure using an MMR-based system
access to measure the die temperature variations in real-time.
TMU features include the following:
• On-chip temperature sensing
• Programmable over temperature and under temperature
limits
• Programmable conversion rate
• Averaging feature available
Power Supplies
The processors have separate power supply connections for
• Internal (VDD_INT)
• External (VDD_EXT)
• External (VDD_REF)
• HADC/TMU (VDD_ANA)
• DMC (VDD_DMC)
• PLL (VDD_PLL)
All power supplies must meet the specifications provided in the
Preliminary Operating Conditions section. All external supply
pins must be connected to the same power supply.
Power Management
As shown in Table 8, the processors support six different power
domains, which maximizes flexibility while maintaining com-
pliance with industry standards and conventions.
The power dissipated by a processor is largely a function of the
clock frequency and the square of the operating voltage. For
example, reducing the clock frequency by 25% results in a 25%
reduction in dynamic power dissipation.
Power-Up and Power-Down Sequencing
At all times (including during power-up/power-down sequenc-
ing), the VDD_REF, VDD_ANA, and VDD_EXT supplies must
stay within the VDELTA_EXT_REF specification listed in the Pre-
liminary Operating Conditions table. Processor pins in the
VDD_EXT domain might have an unknown state during
power-up/power-down. External components sharing these
pins on the board must determine if there are any issues that
need addressing based on this behavior. See the ADSP-
SC595/SC596/SC598 Designer Quick Reference for pins in the
VDD_EXT domain. SYS_XTAL0 and SYS_XTAL1 oscillations
(SYS_CLKIN0 and SYS_CLKIN1) start when power is applied
to the VDD_REF pins. The rising edge of SYS_HWRST initiates
the PLL locking sequence. The rising edge of SYS_HWRST
must occur after all voltage supplies and SYS_CLKIN0 and
SYS_CLKIN1 oscillations are valid. For further details and
information, see the Power-Up Reset Timing section.
Target Board JTAG Emulator Connector
The Analog Devices DSP tools product line of JTAG emulators
uses the IEEE 1149.1 JTAG test access port of the processors to
monitor and control the target board processor during emula-
tion. The Analog Devices DSP tools product line of JTAG
emulators provides emulation at full processor speed, allowing
inspection and modification of memory, registers, and proces-
sor stacks. The processor JTAG interface ensures the emulator
does not affect target system loading or timing.
For information on JTAG emulator operation, see the appropri-
ate emulator hardware user’s guide at SHARC Processors
Software and Tools.
SYSTEM DEBUG
The processors include various features that allow easy system
debug. These are described in the following sections.
Table 7. Boot Modes
SYS_BMODE[n] Setting
Boot Mode
000
No boot
001
SPI2 flash
010
External SPI2 host
011
External UART0 host
100
External LP0 host
101
Octal SPI flash
110
eMSI boot (eMMC)
Table 8. Power Domains
Power Domain
VDD Range
All Internal Logic
VDD_INT
DDR3/DDR3L
VDD_DMC
HADC/TMU
VDD_ANA
SYS_CLKIN0/1
VDD_REF
1
1 VDD_REF requires a minimum of 10 nF and 100 nF decoupling capacitance to
meet source/sink requirements.
PLL0/1
VDD_PLL
2
2 Connect VDD_PLL to VDD_INT. See ADSP-SC595/SC596/SC598 Designer Quick
Reference for additional details.
All Other I/O (Includes SYS, JTAG, and
Ports Pins)
VDD_EXT



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